Thermal modeling and analysis of three-dimensional integrated circuits with irregular structure

Considering the manufacturing and packaging process, three-dimensional integrated circuits design often requires irregular chip structures. Three-dimensional with structures can facilitate differentiated reduce costs. Highly complex through-silicon vias have not been considered in past thermal modeling analysis of irregularly structured circuits. Thus, a detailed model three-layer 3D circuit microbumps is developed, an analytical method based on resistance network proposed to extract equivalent conductivity microbumps, accuracy which verified by finite element simulation method. The results show that maximum temperature gradient obtained simulations agree well results, proving validity model. To save computational cost, effects heat source area, power setting structure parameters are studied numerical Heat area equal overlap between layers, high chips close sink, reducing pitch better temperature. provide reference value for optimization